TSV CMP Contract Processing
Successfully reduced processing time! It is now possible to minimize dishing to the extreme.
We offer "TSV CMP Contract Processing." By applying a CMP process using a slurry that ensures nearly 10 times the processing speed compared to the Cu slurry typically used for semiconductor Cu CMP, we can complete processing in a short time. With our CMP contract processing, we have achieved ultra-high precision and low cost through the establishment of ultra-fast Cu CMP. 【Features】 ■ Reduced processing time ■ Contributes to improved processing accuracy ■ Ultra-fast Cu CMP process ■ Minimization of dishing ■ Achieves ultra-high precision and low cost *For more details, please refer to the PDF document or feel free to contact us.
- 企業：D-process
- 価格：Other
